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The market is driven by the incentives and discounts for seeing customers, increase in capital spending, and miniaturization of components. This study identifies the use of NEMs as one of the prime reasons driving the semiconductor wafer polishing and grinding equipment market growth during the next few years. Also, the growth of ULSI and transition toward 3d structures will lead to sizable demand in the market. The reports on semiconductor wafer polishing and grinding equipment market provide a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors. The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment. The semiconductor wafer polishing and grinding equipment market analysis includes end-user segment, application segment and geographical landscapes.
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